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Chinese Journal of Mechanical Engineering

Table 2 Parameters of creep

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Materials

C1 (s−1)

C2 (MPa−1)

C3

C4 (K)

Sn-3.9Ag-0.6Cu

441000

5×10-9

4.2

5412

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