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Table 2 Parameters of creep

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Materials C1 (s−1) C2 (MPa−1) C3 C4 (K)
Sn-3.9Ag-0.6Cu 441000 5×10-9 4.2 5412