Skip to main content

Table 3 Control factors and levels

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Control factors   Level 1 Level 2 Level 3
A IMC Cu6Sn5 Cu3Sn N3Sn4
B High Temperature (K) 423 398 373
C Low Temperature (K) 233 218 213
D Dwell time (min) 15 12.5 10