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Chinese Journal of Mechanical Engineering

Table 3 Control factors and levels

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Control factors

 

Level 1

Level 2

Level 3

A

IMC

Cu6Sn5

Cu3Sn

N3Sn4

B

High Temperature (K)

423

398

373

C

Low Temperature (K)

233

218

213

D

Dwell time (min)

15

12.5

10

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