Skip to main content
Chinese Journal of Mechanical Engineering

Table 4 Main experiment

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

EXP.

Factor and level

Quality

A

B

C

D

\(\Delta \varepsilon\)

S/N

1

1

1

1

1

0.08422

21.49

2

1

2

2

2

0.07053

23.03

3

1

3

3

3

0.05579

25.07

4

2

1

2

3

0.08338

21.58

5

2

2

3

1

0.07061

23.02

6

2

3

1

2

0.05621

25.00

7

3

1

3

2

0.08382

21.53

8

3

2

1

3

0.06952

23.16

9

3

3

2

1

0.05707

24.87

Average

23.19

Back to article page