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Table 4 Main experiment

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

EXP. Factor and level Quality
A B C D \(\Delta \varepsilon\) S/N
1 1 1 1 1 0.08422 21.49
2 1 2 2 2 0.07053 23.03
3 1 3 3 3 0.05579 25.07
4 2 1 2 3 0.08338 21.58
5 2 2 3 1 0.07061 23.02
6 2 3 1 2 0.05621 25.00
7 3 1 3 2 0.08382 21.53
8 3 2 1 3 0.06952 23.16
9 3 3 2 1 0.05707 24.87
Average 23.19