Table 1 Experiment conditions
From: Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Machine | Pressure (psi) | Upper plate rotation speed (r/min) | Lower plate rotation speed (r/min) | Slurry | Processing time (min) |
|---|---|---|---|---|---|
Double-sided lapping | 1.5 | 40 | 40 | Water | 30 |