Table 2 The main mechanical properties of the thin copper sheet
From: Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Parameter | Value |
|---|---|
Young’s modulus (MPa) | 119000 |
Poisson’ s ratio | 0.34 |
Density (kg/m3) | 8960 |
From: Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping
Parameter | Value |
|---|---|
Young’s modulus (MPa) | 119000 |
Poisson’ s ratio | 0.34 |
Density (kg/m3) | 8960 |