Table 6 Process simulation molding parameters
Laser power P(W) | Scan speed v(mm/s) | Scan distance h(mm) | Layer thickness L(μm) | Substrate temperature T(℃) |
|---|---|---|---|---|
220 | 960 | 0.06 | 0.03 | 50/100/150/200 |
Laser power P(W) | Scan speed v(mm/s) | Scan distance h(mm) | Layer thickness L(μm) | Substrate temperature T(℃) |
|---|---|---|---|---|
220 | 960 | 0.06 | 0.03 | 50/100/150/200 |