Skip to main content

Table 4 Overview of process features and material properties for all process-material combinations

From: Micro-scale Realization of Compliant Mechanisms: Manufacturing Processes and Constituent Materials—A Review

Process

Material

Smallest resolution (μm)

Max. thickness (μm)

Aspect ratio

Manuf. error

Manuf. cost

Young’s Modulus (GPa)

Poisson’s ratio

Failure strength (MPa)

Max. allowable strain (%)

Surface micromachining

Polysilicon [46]

1‒5

< 10

< 10

Low

High

150‒170

0.23

~ 1640

~ 1.05

Aluminium [112]

1‒5

2

Low

60‒75

0.32

~ 100

~ 0.15

PI-2611 [113]

20‒50

10

8.5

350

Bulk micromachining

Silicon [114]

1‒5

20‒30

Low

High

150‒170

0.23

< 7000*1

1‒2

PET [52]

~ 20

250

~ 10

Low

2.8

0.37‒0.44

60

2

Laser micromachining

Aluminium [115]

20‒30

< 100

< 5

High

Low

70

0.35

276

0.4

Nickel [62]

20‒30

10‒20

< 1

High

Low

210

0.31

475

0.2

PMMA [64]

500

~ 1000

~ 2

High

Low

1.8

0.35

76

4

PU [116]

~ 10

100‒200

10‒20

High

Low

0.076

PZT [65]

100

200

< 1

High

Low

67

0.3

0.1

Wire EDM

Titanium [69]

100‒200

~ 1000

5‒10

 

Low

116

0.32

950

0.8

Aluminium [68]

100‒200

500‒1000

< 10

 

Low

70

0.35

276

0.4

Micro molding

Nickel (LIGA) [57]

< 1

200

100

Low

High

115±10

0.31

~ 310

0.3

Nickel [76]

~ 5

20‒200*2

10

High

Low

110‒220*3

0.31

~ 310

0.1‒0.3

Nife [117]

~ 5

20‒200*2

10

High

Low

182

0.3

PDMS [25]

High

Low

3×10−4‒1.8×10−3

0.38

2.24

~ 200

POM [79]

High

Low

2.57

0.38

62

2.4

SU-8 processing

SU-8 [118]

10‒20

> 500

40‒50

High

Low

2‒5

0.22

35‒70

1‒2

CNT frameworking

CNT-PDMS [99]

10

< 100

10

High

Low

1.89×10−2/7.95×10−3

0.20

20

CNT-carbon [33]

10

> 200

40

Low

4‒6

0.28

~ 110

2‒2.5

3D printing

FDM/ABS [102]

200

High

Low

1.19‒2.9

0.29

18.5‒51

0.6‒4

FDM/nylon [103]

200

High

Low

2.6‒3.0

0.39

78

2‒3

SLA/R11 [106]

25

> 1000

> 40

Low

High

2

0.3

54

2.7

2PP/IP-Dip [110]

1

> 50

> 50

Low

High

3‒4

~ 60

1.5‒2

ΜCLIP/CN982A75&PEGDA [105]

7‒8

> 1000

> 100

Low

High

0.014‒0.021

0.3

  1. Note: *1Petersen reported that single-crystal silicon has a failure strength of 7 GPa [53]. It is commonly accepted that the failure strength of single-crystal silicon is slightly higher than that of polysilicon, but not as high as 7 GPa
  2. *2The maximum thickness depends on the mold material used. For example, SU-8 can mold structures as thick as 200 μm, whereas AZ4620 only allows 20 μm
  3. *3The mechanical properties of electroplated nickel strongly depend on the electroplating conditions