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Table 1 Parameters of materials

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Materials E (MPa) μ CTE (×10−6K−1)
Sn-3.9Ag-0.6Cu 43700-22.3T 0.40 20.9
Chip 163000 0.28 2.5
BT 26000 0.39 15.0
Cu 117000 0.23 16.6
Ni 207000 0.31 13.1
Cu3Sn 143000 0.30 18.2
Cu6Sn5 124000 0.30 19.0
Ni3Sn4 134000 0.33 13.7