Chinese Journal of Mechanical Engineering

Table 1 Parameters of materials

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

Materials	E (MPa)	μ	CTE (×10⁻⁶K⁻¹)
Sn-3.9Ag-0.6Cu	43700-22.3T	0.40	20.9
Chip	163000	0.28	2.5
BT	26000	0.39	15.0
Cu	117000	0.23	16.6
Ni	207000	0.31	13.1
Cu₃Sn	143000	0.30	18.2
Cu₆Sn₅	124000	0.30	19.0
Ni₃Sn₄	134000	0.33	13.7

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