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Chinese Journal of Mechanical Engineering

Table 5 S/N response and rank

From: Effect of Thermal Cyclic Loading on Stress-Strain Response and Fatigue Life of 3D Chip Stacking Structure

 

Factor and level

A

B

C

D

Level 1

23.20

21.53

23.22

23.13

Level 2

23.20

23.07

23.16

23.19

Level 3

23.19

24.98

23.21

23.27

Effect

0.01

3.45

0.06

0.14

Rank

4

1

3

2

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