Skip to main content

Table 4 Machining setting

From: Grindability Evaluation of Ultrasonic Assisted Grinding of Silicon Nitride Ceramic Using Minimum Quantity Lubrication Based SiO2 Nanofluid

S/N

Grinding conditions

 

Physical quantity

Magnitude

1

Grinding wheel speed vs (m/s)

31.42

2

Table speed vw (m/min)

10

3

Depth of cut ae

10 cycles of 5 µm (50 µm)

4

Grinding wheel

Diamond-SD120M100M

5

Wheel external diameter (mm)

200

6

MQL flow rate (mL/h)

150

7

Pressure (bar)

10

8

Stand-off distance (mm)

55

9

Nozzle inclination angle (º)

30

10

Work material

Si3N4

11

Depth of dressing (μm)

20

12

Feed rate of dress (mm/min)

500